A vacuum manifold having a right-angled opening connected to a square-shaped opening for a lighting field to be projected through a right-angled opening with a vacuum access bore. The vacuum manifold is disposed between the photoresist-coated wafer and the lens elements in the photolithography . The relatively high illumination energy in the illumination field used to project the image of the reticle onto the photoresist-coated wafer often results in melt removal, evaporation, and spillage of material that is coated on the lens element. A vacuum manifold disposed between the lens element and the photoresist-coated wafer forms airflow to prevent debris or contamination to prevent coating of the lens surface. This prevents the image quality from deteriorating over time, and also reduces the downtime required to clean or maintain the photolithography .
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