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Manufacturing equipment of semiconductor device and wafer access method to this equipment
Manufacturing equipment of semiconductor device and wafer access method to this equipment
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机译:半导体装置的制造设备以及对该设备的晶圆存取方法
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摘要
The present invention discloses a manufacturing apparatus for a semiconductor device and a wafer access method for the apparatus. The present invention includes a pressure buffer means in a chamber, such as a load lock chamber, of a manufacturing facility in a semiconductor device. The pressure buffer means may be constituted by a valve, a filter, or a combination thereof. By the pressure buffer means, the inside and outside of the load lock chamber can be thermodynamically balanced. Therefore, in the case where the wafer enters the load lock chamber from the wafer cassette or vice versa, vortices caused by the pressure difference between the two regions can be prevented, so that particle contamination of the wafer due to the vortices can be prevented.
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