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Thin film transistor substrate and manufacturing method using molybdenum and molybdenum alloy
Thin film transistor substrate and manufacturing method using molybdenum and molybdenum alloy
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机译:薄膜晶体管基板以及使用钼和钼合金的制造方法
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摘要
Molybdenum, or a mixture of tungsten and molybdenum is deposited on a substrate to form a wiring for a semiconductor device. Particularly, when the gate / data wiring of the liquid crystal display device is formed, the molybdenum alloy exhibits an etching ratio similar to that of aluminum or an aluminum alloy having a low resistance to an aluminum etching solution, so that the wiring is made of a molybdenum alloy and a double A gentle slope etching is possible in the case of a film. Further, when the transparent conductive film is formed of the ITO film, the dry etching gas Cl2+ O2+ Ar. /RTI Particularly, in the manufacturing process using the four-layer mask, the ITO film and the molybdenum or molybdenum-tungsten alloy film are simultaneously etched at the same time in order to expose the doped amorphous silicon film. Further, the molybdenum or molybdenum-tungsten alloy film and the amorphous silicon film are simultaneously etched at the same time. At this time, by dry etching, Cl2+ O2+ Gradient etching is possible with Ar gas.
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机译:钼或钨和钼的混合物沉积在基板上以形成用于半导体器件的布线。特别地,当形成液晶显示装置的栅极/数据布线时,钼合金的蚀刻率与铝或对铝蚀刻液的电阻低的铝合金的蚀刻率相似,因此该布线由钼合金和双层膜的情况下可以进行缓坡刻蚀。此外,当透明导电膜由ITO膜形成时,干蚀刻气体Cl 2 Sub> + O 2 Sub> + Ar。特别地,在使用四层掩模的制造过程中,同时同时蚀刻ITO膜和钼或钼-钨合金膜,以暴露掺杂的非晶硅膜。此外,钼或钼钨合金膜和非晶硅膜同时被同时蚀刻。此时,通过干蚀刻,可以用Ar气进行Cl 2 Sub> + O 2 Sub> +梯度蚀刻。
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