SHUTTLE SPOON ASSEMBLY OF SEMICONDUCTOR WAFER LOADING

摘要

The present invention provides a shuttle spoon assembly for loading and unloading a wafer spoon and a plurality of holding members provided on the shuttle spoon to provide a friction force when holding the wafer to load and unload a wafer inserted into a slot of a cassette. The thickness of the shuttle spoon to the top surface of the holding member is configured to be at least ½ or less with respect to the interval between the slots of the cassette, the holding member is made of ceramic, formed in a circular pad type One configuration. Therefore, there is no damage to the wafer in the process of holding the wafer from the cassette, there is no rejected wafer, thereby improving the yield and productivity.