THREE-DIMENSIONAL MULTI-CHIP MODULE HAVING STACKED SEMICONDUCTOR CHIPS AND PROCESS OF FABRICATION THEREOF

摘要

The plurality of semiconductor chips 21a to 21d are sequentially coupled to each other to form a stacked semiconductor chip structure 21, the stacked semiconductor chip structure being received in a cavity formed in the insulating carrier 22; The semiconductor chips 21a to 21d are sequentially stacked, and the conductive pattern 22c formed on the lower surface of the insulating carrier is connected to the electrodes 21h / 21i of each of the semiconductor chips through the coupling wires 23, and 3 Dimensional multi-chip modules are slightly higher than stacked semiconductor chip structures.