Half conductor component arrangement with a component having an auxiliary element in vsmp - design

摘要

The VSMP semiconductor component comprises at least one semiconductor chip (9), electrically conductive connectors or terminal elements (8) and a housing (1). The latter contains the at least one semiconductor chip (9). The connector elements are conductively connected to contact pads on the semiconductor chip and are fed out from a first short side (13) of the housing. An electrically conductive and/or heat conducting auxiliary element (2) for positioning on a circuit board, extends from the housing (1) at least at one further short side (12). A second auxiliary element may extend from a different side of the housing. At least one auxiliary element (2) preferably at least partly surrounds the chip on three sides.