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multiaxial oriented thermotropes polymersubstrat for a printed bedrahtungsbrett

机译:多轴取向的热致各向异性聚合物基质,用于印刷bedrahtungsbrett

摘要

The present invention is directed to the use of multiaxially oriented (e.g., biaxially) thermotropic polymers as a substrate material for the preparation of printed wire boards (PWB). In preferred embodiments, the PWB of the present invention comprises a generic, high density, organic multilayer PWB comprising XYDAR TM and/or VECTRA TM films, capable of being employed as a high density leadless perimeter and in grid array ceramic chip packages.
机译:本发明涉及多轴取向(例如,双轴)热致聚合物作为制备印刷线路板(PWB)的基材的用途。在优选的实施方案中,本发明的PWB包括通用的,高密度的有机多层PWB,其包含XYDAR TM和/或VECTRA TM膜,能够用作高密度无铅周界并用于栅格阵列陶瓷芯片封装中。

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