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semiconductor pressure transducers with polysilicon and single crystal membrane - dehnungsmesstreifen and manufacturing process used

机译:多晶硅和单晶膜的半导体压力传感器-dehnungsmesstreifen及其制造工艺

摘要

A semiconductor pressure sensor (10) utilizes single-crystal silicon piezoresistive gage elements (18) dielectrically isolated by silicon oxide (16) from other such elements, and utilizes an etched silicon substrate (12). P-type implants form p-type piezoresistive gage elements (18) and form p+ interconnections (20) to connect the sensor to external electrical devices. The diaphragm (14) is made from polysilicon and is deposited on top of the gage elements (18). IMAGE
机译:半导体压力传感器(10)利用由氧化硅(16)与其他这样的元件介电隔离的单晶硅压阻计元件(18),并利用蚀刻的硅衬底(12)。 P型植入物形成p型压阻计元件(18),并形成p +互连(20),以将传感器连接到外部电子设备。隔膜(14)由多晶硅制成,并沉积在量规元件(18)的顶部。 <图像>

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