Room temperature storage-stable, heat-curable, low CTE, one component epoxy resin tooling material

摘要

The present invention pertains to a one component curable epoxy resin composition which is storage-stable at ambient temperature and which maintains a post-cured high glass transition temperature (Tg) of above 130 C. and a low coefficient of thermal expansion (CTE) of less than 1.7610.sup.-5 cm/cm/C. over a temperature range of - 30 to 125 C., and thus finds practical utility in tooling applications. The epoxy resin composition comprises an epoxy resin or mixture thereof, a multifunctional epoxy resin diluent, a boron trichloride amine complex, and at least one filler selected from the group consisting of a silica or a silicate. The invention also relates to the cured product.