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Thin support for PC board transfer system

机译:对PC板传输系统的精简支持

摘要

A transfer system that supports circuit boards as it conveys them through a reflow oven. The system uses a sag support between edge supports. The sag support does not have to move as the circuit board is transferred along the transfer system. The height of the sag support can be easily adjusted. The sag support's mounts can maintain appropriate tension in the sag support even if the sag support expands during operation. The system may use a mechanism to prevent the friction between the boards and the sag support from interfering with the movement of boards along the transfer system.
机译:传输系统支撑电路板,使其通过回流焊炉。系统在边缘支架之间使用下垂支架。随着电路板沿着传输系统传输,下垂支撑不必移动。垂度支撑的高度可以容易地调整。即使下垂支撑在操作过程中膨胀,下垂支撑的支架也可以在下垂支撑中保持适当的张力。该系统可以使用一种机构来防止板和下垂支撑件之间的摩擦干扰板沿着传送系统的运动。

著录项

  • 公开/公告号US5871325A

    专利类型

  • 公开/公告日1999-02-16

    原文格式PDF

  • 申请/专利权人 JABIL CIRCUIT INC.;

    申请/专利号US19970934149

  • 发明设计人 RONALD P. SCHMIDT;RICHARD J VAN.EVERY;

    申请日1997-09-23

  • 分类号F27B9/24;

  • 国家 US

  • 入库时间 2022-08-22 02:08:41

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