Techniques for reducing particulate contamination on a substrate during processing

摘要

A substrate processing system configured for processing a substrate utilizing source gas released from at least one gas jet into a substrate processing chamber of the substrate processing system. The substrate processing system includes a first gas port configured to introduce the gas jet into the substrate processing chamber and a directional blocking wall protruding above a plane formed by the opening of the first gas port. The directional blocking wall is disposed closer to a first portion of a circumference of the first gas port than a second portion of the circumference. The first portion of the circumference is configured to be disposed toward a given portion of the substrate processing chamber when the gas distribution plate is positioned within the substrate processing chamber such that the directional blocking wall is disposed between the gas jet and the given portion of the substrate processing chamber, thereby preferentially reducing the entrainment of the gas from the given portion of the substrate processing chamber into the gas jet when the gas jet is released into the substrate processing chamber.