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EMI design and evaluation methods of electronic equipment

机译:电子设备的EMI设计与评估方法

摘要

PROBLEM TO BE SOLVED: To provide an EMI designing and evaluating method which enables the effective use time of EMI evaluation facilities and shortens the designing and evaluation period by saving the labor and material cost at the time of designing and evaluation. ;SOLUTION: Based on design data on a power source/GND layer extracted in an extracting process S14, a model is generated in a model generating process S19 and based on this model, surface analytic simulation is performed in a surface analytic simulation process S20. Simultaneously with this surface analytic simulation, a substrate having only the power source/GND layer is manufactured in a substrate manufacturing process S15 and the result of the surface analytic simulation is matched with the actual measurement result of a frequency characteristic S parameter by the manufactured substrate alone in a 1st measuring and investigating process S16; when they match each other, a bypass capacitor is mounted on the substrate having only the power source/GND layer in a bypass capacitor mounting process S17 and information on them is fed back to a mounting detailed designing process S8.;COPYRIGHT: (C)1999,JPO
机译:要解决的问题:提供一种EMI设计和评估方法,该方法能够有效利用EMI评估设备的时间,并通过节省设计和评估时的人工和材料成本来缩短设计和评估周期。 ;解决方案:基于在提取过程S14中提取的关于电源/ GND层的设计数据,在模型生成过程S19中生成模型,并且基于该模型,在表面分析仿真过程S20中执行表面分析仿真。与该表面分析模拟同时,在基板制造工序S15中制造仅具有电源/ GND层的基板,使表面分析模拟的结果与所制造的基板的频率特性S参数的实测结果一致。在第1测定调查工序S16中单独进行。当它们彼此匹配时,在旁路电容器安装过程S17中,将旁路电容器安装在仅具有电源/ GND层的基板上,并将关于它们的信息反馈到安装详细设计过程S8 。;版权所有:(C) 1999年

著录项

  • 公开/公告号JP3052907B2

    专利类型

  • 公开/公告日2000-06-19

    原文格式PDF

  • 申请/专利权人 日本電気株式会社;

    申请/专利号JP19970222877

  • 发明设计人 井上 博文;関原 和彦;田浦 徹;

    申请日1997-08-20

  • 分类号G06F17/50;H05K3/00;H05K13/08;

  • 国家 JP

  • 入库时间 2022-08-22 02:05:56

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