首页> 外国专利> The pattern conductor structure, especially the minute pattern conductor structure and that production method of being arranged on the non-conductive backing material

The pattern conductor structure, especially the minute pattern conductor structure and that production method of being arranged on the non-conductive backing material

机译:图案导体结构,特别是微小图案导体结构,以及在非导电性背衬材料上配置的制造方法

摘要

(57) Abstract It regards the pattern conductor structure and especially the minute pattern conductor structure where this invention consists of with the metal conversion layer which is applied with respect to the heavy metal content base and that base, is arranged on the non-conductive backing material. As for this invention, thing and the backing material which contain the heavy metal which the heavy metal content base in the territory of the pattern conductor structure, occurs organic characteristic of non-conductive with the disassembly of the heavy metal complex salt nucleus, the minute porosity which the heavy metal nucleus has connected or minuteness roughly features that the carrier particle of the surface is contained. This method achieves connecting to which the pattern conductor road which is precipitated is superior. This method especially is suitable for the production of three dimensional circuit baseplate.
机译:(57)<摘要>本发明涉及图案导体结构,尤其是微小图案导体结构,其中本发明由相对于重金属含量基底施加的金属转化层构成,并且该基底布置在非导体上。导电背衬材料。对于本发明,在重金属络合物盐核的分解中,包含重金属成分在图案导体结构的范围内所含的重金属的物质和底材在不发生重金属络合物盐核的情况下表现出非导电性。重金属核连接的孔隙率或微小度的特征在于,含有表面的载体粒子。该方法实现了所连接的析出的图案导体路优越的连接。该方法特别适合于三维电路基板的生产。

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