Die bonding pretreatment method, die bonding method and circuit baseplate for die bonding

摘要

PROBLEM TO BE SOLVED: To provide a circuit board having a semiconductor chip having a high adhesion strength enough and difficult to cause a trouble such as poor insulation by washing conductor parts by a laser beam. SOLUTION: A circuit board 3 having a die bonding part 1 and inner leads 2 disposed round this part is washed by irradiating a laser beam thereon and then, prior to the die bonding with an adhesive agent fed to the part 1 and thermally hardened, a step is down to block resin grains scattered by the laser beam irradiation and deposited to the surface of the part from affinity with solvents contained in the adhesive agent.