FILM-THICKNESS MEASURING METHOD, POLISHING METHOD, MANUFACTURE OF THIN-FILM MAGNETIC HEAD, AND THIN-FILM MAGNETIC HEAD FORMATION SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a film-thickness measuring method for measuring a remaining thickness of a film to be polished in a polishing process at high precision, related to a film-thickness measuring method for measuring the thickness of an element formation layer on a substrate. ;SOLUTION: Related to a manufacturing method for a thin-film magnetic head, a lower part shield layer 16 together with a dummy layer 54 are formed, which are coated with alumina, and the surface is polished by CMP to form a flattened layer 24. Then an upper part shield layer 32 is formed on the lower part shield layer 16, and alumina is buried to form a flattened layer 38. The thickness of the embedded layer 38 on the dummy layer 54 is measured with a non-contact optical film-thickness measuring device, and based on the thickness, the thickness of the upper part shield layer 32 is measured.;COPYRIGHT: (C)2000,JPO