AUXILIARY PRINTED WIRING BOARD FOR AREA ARRAY PACKAGE IC, IC TEST METHOD, AND REPAIRING METHOD OF PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide an auxiliary printed wiring board which enables a spare area array package IC to be mounted without producing solder bridges or solder balls when pads are damaged or come off when a surface-mounted part is dismounted from a printed wiring broad, a repairing operation to be carried out for a printed wiring board by the use of a strap wiring, and ICs and a printed wiring board to be tested keeping the ICs mounted on the wiring board.;SOLUTION: An area array package IC auxiliary printed wiring board 20 is used being sandwiched in between an area array package IC 12 equipped with a large number of connection terminals arranged two-dimensionally nearly like grids and a printed wiring board 10 surface-mounted with the package IC 12, where the auxiliary printed wiring board 20 is equipped with a board larger than the package IC 12, a large number of through holes 24 bored in the wiring board 2 at positions corresponding to the connection terminals of the IC 12, a large number of auxiliary pads 26 formed on the one surface of the board 20 and located outside the package IC 12, and a wiring pattern that connects the auxiliary pads 26 to the through-holes 24.;COPYRIGHT: (C)2000,JPO