DEBURRING METHOD OF SEMICONDUCTOR AND WIDE GUN FOR DEBURRING

摘要

PROBLEM TO BE SOLVED: To deburr a semiconductor at good work efficiency without impairing a light-receiving part of the semiconductor using an installment having a low- cost and simple constitution. ;SOLUTION: A mask is disposed on surfaces of semiconductors 11-14, 21-24 and an abrasive is injected from a plurality of injection nozzles 1a, 1b of a wide gun 1 for deburring a surface having a plurality of injection nozzles 1a, 1b corresponding to their respective lead parts 3a, 3b. The surfaces of the semiconductors 11-14, 21-24 are deburred by moving the wide gun 1 for deburring a surface in parallel to the lead parts 3a, 3b while applying an abrasive locally and concurrently to the burr portion of a plurality of the semiconductors 11-4, 21-24. After the deburring work of a back surface of the semiconductor is carried out by a wide gun for deburring a back surface having a plurality of injection nozzles similarly corresponding to their respective lead parts 3a, 3b, the semiconductor is primarily washed by both surface shower and is secondarily washed by a washing wide gun.;COPYRIGHT: (C)2000,JPO