METHOD FOR TRUING CYLINDER GRINDING WHEEL, AND METHOD FOR GRINDING SEMICONDUCTOR WAFER BY MEANS OF CYLINDER GRINDING WHEEL FORMED IN THE TRUING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method for truing a cylinder grinding wheel to perform high-precise truing even when machine precision (a motion error) of a drive system for the truing material is lower than demand precision of the truing. ;SOLUTION: This method for truing a cylinder grinding wheel 10 to move a truing material, making contact with the peripheral surface of the rotating cylinder grinding wheel 10, in the direction of the width of the grinding wheel to effect truing of the outer peripheral surface of the cylinder grinding wheel 10 in an arbitrary shape, the forward and backward movement direction (a push direction) of the truing material to and from the cylinder grinding wheel 10 is extended in an inclination angle direction inclined at an angle of 10° or less to the normal LH side based on a tangential line LS on the contact position of the truing material, and the truing track of the truing material is a curved track containing a straight line or a circular arc.;COPYRIGHT: (C)2000,JPO