SOLDER PASTE SUPPLY DEVICE AND SOLDER PASTE SUPPLY METHOD
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机译:焊膏供应装置及焊膏供应方法
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摘要
PROBLEM TO BE SOLVED: To supply a solder paste without manual work and to make eliminaable the degradation of the quality of the solder paste and the adverse effect of lead on the human body even at the time of supplying a high viscosity solder paste. ;SOLUTION: A base plate 10 is arranged above a solder paste printer and a bag body 39, in which the solder paste 38 is filled, is attached to the base plate. The solder paste is squeezed from the lower end opening part of the bag body by moving a compression roller 22 downward while pressing the bag body to the base plate with the compression roller.;COPYRIGHT: (C)2000,JPO
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