首页> 外国专利> SOLDER PASTE SUPPLY DEVICE AND SOLDER PASTE SUPPLY METHOD

SOLDER PASTE SUPPLY DEVICE AND SOLDER PASTE SUPPLY METHOD

机译:焊膏供应装置及焊膏供应方法

摘要

PROBLEM TO BE SOLVED: To supply a solder paste without manual work and to make eliminaable the degradation of the quality of the solder paste and the adverse effect of lead on the human body even at the time of supplying a high viscosity solder paste. ;SOLUTION: A base plate 10 is arranged above a solder paste printer and a bag body 39, in which the solder paste 38 is filled, is attached to the base plate. The solder paste is squeezed from the lower end opening part of the bag body by moving a compression roller 22 downward while pressing the bag body to the base plate with the compression roller.;COPYRIGHT: (C)2000,JPO
机译:解决的问题:即使在提供高粘度焊膏时,也无需手工操作即可提供焊膏,并且可以消除焊膏质量的下降以及铅对人体的不利影响。 ;解决方案:将基板10布置在焊膏打印机的上方,并将填充有焊膏38的袋体39附接到基板上。通过用压缩辊将袋体压向基板的同时向下移动压缩辊22,将锡膏从袋体的下端开口部分挤压。COPYRIGHT:(C)2000,JPO

著录项

  • 公开/公告号JP2000051761A

    专利类型

  • 公开/公告日2000-02-22

    原文格式PDF

  • 申请/专利权人 SONY CORP;

    申请/专利号JP19990180108

  • 发明设计人 HONDA KOUJI;HIRAIWA HIROSHI;

    申请日1995-01-31

  • 分类号B05C5/00;B05C11/10;B05D1/26;B23K3/06;H05K3/34;

  • 国家 JP

  • 入库时间 2022-08-22 02:01:05

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号