RESIN COMPOSITION, RESIN COMPOSITION LAYERED PRODUCT USING THE SAME, MANUFACTURE OF WIRING CIRCUIT AND MULTILAYER WIRING CIRCUIT, WIRING CIRCUIT AND THE MULTILAYER WIRING CIRCUIT

摘要

PROBLEM TO BE SOLVED: To provide a material for forming a wiring circuit without using a metal- laminated substrate and hazardous process by using a resin composition containing a conductivity expression material, in a base resin with conductivity changeable by a certain effect. ;SOLUTION: This resin composition has a microcapsule, having a wall material of polyurethaneurea and having a core material containing a conductive inorganic material, a base resin, a photopolymerizable unsaturated compound containing at least one ethylene unsaturated group and a photopolymerization initiator. On a support body 2b, the resin composition is laminated to form a resin composition layer 1a whose conductivity is raised thermal effect. At exposed part (a) attained by a laser- exposure in a pattern shape and a non-exposed part (b) unexposed at that time are exposed over the entire surface and then pressed; the exposed part (a) expresses conductivity to be a conductive part (c) and the non-exposed part (b) does not exhibit conductivity but remains as an insulative part (d). They are heated and hardened to fix the condition of having the conductive part (c) and the insulative part (d), so that change with time passage is suppressed and an interconnection circuit is obtained.;COPYRIGHT: (C)2000,JPO