首页> 外国专利> ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD OF CUTTING EMPTY TAPE IN THE ELECTRONIC COMPONENT MOUNTING APPARATUS

ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD OF CUTTING EMPTY TAPE IN THE ELECTRONIC COMPONENT MOUNTING APPARATUS

机译:电子组件安装装置以及在电子组件安装装置中切割空胶带的方法

摘要

PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus which can efficiently cut an empty tape and have a compact cutting apparatus, and a method of cutting the empty tape in the electronic component mounting apparatus.;SOLUTION: In an electronic component mounting apparatus which picks up an electronic component from a supply of electronic components to load it on a substrate, a plurality of tape feeders are arranged which feed electronic components held to the tape in the supply to the pick-up positions, and an empty tape cutting apparatus 23 is provided, which cuts empty tapes from these tape feeders. The empty tape cutting means 23 comprises a fixed blade 30 with the length of the blade corresponding to the width of arrangement of the tape feeders, a movable blade 31 provided facing opposite the fixed blade 30 across the empty tape to be cut and cylinders 36 and 39, which individually move back and forth both ends of the movable blade 31, respectively, wherein it sequentially cuts the empty tape put between the fixed blade 30 and movable blade 31.;COPYRIGHT: (C)2000,JPO
机译:解决的问题:提供一种能够有效地切割空带并且具有紧凑的切割设备的电子部件安装设备,以及在电子部件安装设备中切割空带的方法。该装置从电子元件的供给中拾取电子元件以将其装载到基板上,布置多个带式供料器,该带式供料器将在供给中保持在带上的电子元件供给到拾取位置,以及空的带切割装置提供了23,其从这些带式供料器切割空带。空带切割装置23包括:固定刀片30,其长度与带式供料器的布置宽度相对应;可移动刀片31,其与固定刀片30相对,横跨待切割的空磁带,并与滚筒36和圆柱体36相对。 39,分别分别在可动刀片31的两端前后移动,其中,它依次切掉固定刀片30和可动刀片31之间的空胶带。版权所有:(C)2000,JPO

著录项

  • 公开/公告号JP2000174496A

    专利类型

  • 公开/公告日2000-06-23

    原文格式PDF

  • 申请/专利权人 MATSUSHITA ELECTRIC IND CO LTD;

    申请/专利号JP19980346348

  • 发明设计人 HIDESE WATARU;

    申请日1998-12-07

  • 分类号H05K13/02;

  • 国家 JP

  • 入库时间 2022-08-22 02:00:54

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