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ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD OF CUTTING EMPTY TAPE IN THE ELECTRONIC COMPONENT MOUNTING APPARATUS
ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD OF CUTTING EMPTY TAPE IN THE ELECTRONIC COMPONENT MOUNTING APPARATUS
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机译:电子组件安装装置以及在电子组件安装装置中切割空胶带的方法
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摘要
PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus which can efficiently cut an empty tape and have a compact cutting apparatus, and a method of cutting the empty tape in the electronic component mounting apparatus.;SOLUTION: In an electronic component mounting apparatus which picks up an electronic component from a supply of electronic components to load it on a substrate, a plurality of tape feeders are arranged which feed electronic components held to the tape in the supply to the pick-up positions, and an empty tape cutting apparatus 23 is provided, which cuts empty tapes from these tape feeders. The empty tape cutting means 23 comprises a fixed blade 30 with the length of the blade corresponding to the width of arrangement of the tape feeders, a movable blade 31 provided facing opposite the fixed blade 30 across the empty tape to be cut and cylinders 36 and 39, which individually move back and forth both ends of the movable blade 31, respectively, wherein it sequentially cuts the empty tape put between the fixed blade 30 and movable blade 31.;COPYRIGHT: (C)2000,JPO
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