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COPPER AND COPPER BASE ALLOY EXCELLENT IN WIRE BONDING PROPERTY AND DIE BONDING PROPERTY AND PRODUCTION THEREOF
COPPER AND COPPER BASE ALLOY EXCELLENT IN WIRE BONDING PROPERTY AND DIE BONDING PROPERTY AND PRODUCTION THEREOF
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机译:铜和铜基合金在线键合性能和冲模键合性能方面的优异表现及其生产
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摘要
PROBLEM TO BE SOLVED: To obtain good solderability in a die pat part without using flux by using an alloy in which crystal grain size lies in a specified range, and the center line average roughness (Ra) and the thickness of an oxidized film are controlled to the value equal to or below the specified one respectively. ;SOLUTION: By heat treatment, copper and copper base alloys having 10 to 150 μm crystal grain size, ≤0.15 μm center line average roughness (Ra) and ≤6 nm oxidized film thickness and excellent in wire bonding properties and die bonding properties are obtd. This copper and copper base alloys, which contain, by weight, 0.01 to 0.5% P or at least one kind from the group of Fe, Ni, Sn, Zn, Cr, Co, Si, Mg, Ti and Zr by 0.01 to 5.5% in total, and the balance Cu with inevitable impurities, are heat-treated at 300 to 900°C for 0.01 to 72 hr in an atmosphere of ≤5% oxygen concn. For stably joining a lead frame and a bonding wire, the surface roughness of the material is desirably controlled to 0.06 to 0.12 μm. By controlling the crystal grain size range to the above, solder uniformly spreads.;COPYRIGHT: (C)2000,JPO
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