PRODUCTION METHOD OF HIGH-DENSITY SEMICONDUCTOR SUBSTRATE AND HIGH-DENSITY FIRED SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To offer a structure and a method which enable usage of at least one very thin green tape with an assistance of at least one thick green tape. ;SOLUTION: This method for forming a lamination structure uses at least one organic bonding barrier 33 to bond at least one very thin green sheet 10 and/or at least one green sheet having high-density conductive patterns 26 and 28 to at least one thick green sheet 20. This enables the high-density multilayer ceramic structure to be intactly peeled from the lamination plate, and to be obtained as a product.;COPYRIGHT: (C)2000,JPO