HEAT-RESISTANT ADHESIVE COMPOSITION FOR CSP SUBSTRATE, HEAT-RESISTANT ADHESIVE SHEET USING THE SAME, AND PRODUCTION OF CSP SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To obtain a heat resistant adhesive composition for CSP substrates, excellent in adhesiveness between a polyimide substrate and copper foil and excellent in heat resistance and PCT resistance, and a heat resistant adhesive sheet using the above adhesive composition, and provide a method for producing a CSP substrate by using the heat-resistant adhesive sheet.;SOLUTION: This heat-resistant adhesive composition for CSP substrates comprises 100 pts.wt. siloxane-modified polyamideimide resin and 1-150 pts.wt. thermosetting resin. The heat-resistant adhesive sheet 9 is an adhesive sheet obtained by forming an adhesive onto a polyimide substrate 5 and forming the above CSP substrate in B stage onto at least one side of the polyimide substrate. The method for producing CSP substrates comprises (1) a step for forming through holes becoming solder ball holes onto the above heat resistant adhesive sheet, (2) a step for laminating copper foil onto B stage face 4 on one side of the heat-resistant adhesive sheet, (3) a step for forming a circuit 7 by removing unnecessary parts of copper foil by etching and (4) a step for plating the circuit surface with gold.;COPYRIGHT: (C)2000,JPO