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POLYGLYDICYLPHENYL ETHERS OF ALKYLENE OR ALKYLEOXY CHAINS FOR USE IN MICROELECTRONICS ADHESIVES

机译:用于微电子粘合剂的烯烃或烷基环氧链的聚二苯醚

摘要

POLYGLYDICYLPHENYL ETHERS OF ALKYLENE OR ALKYLEOXY CHAINS FOR USE IN MICROELECTRONICS ADHESIVES ABSTRACT OF THE INVENTION This invention relates to flexible epoxy resins characterized by a low ioniccontamination, total chlorine content less than 0.1%. The epoxy resins are liquids atroom temperatur, have Tg values when cured of less than or equal to 150[err]C, haveneat resin viscosities of 25,000 cps or less at 25[err]C, and have a structural compositioncomprising an oligomeric backbone of alkylene or alkyleneoxy repeat units, terminatedwith an aromatic moiety bearing one or more epoxy functionalities.
机译:烯烃或烷基环氧链的聚二苯醚 用于微电子粘合剂 发明内容 本发明涉及特征在于低离子性的柔性环氧树脂。污染,总氯含量小于0.1%。环氧树脂是液体室温,固化时的Tg值小于或等于150℃,具有在25°C下的纯树脂粘度为25,000 cps或更低,并具有结构组成包含末端为亚烷基或亚烷基氧基重复单元的低聚主链具有带有一个或多个环氧官能团的芳族部分。

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