DEVICE FOR MAGNETRON PLASMA SPRAY COATING AND METHOD FOR SPRAY COATING A SUBSTRATE

摘要

Described is a sputtering apparatus and a method employing an auxiliary magnetic structure (11) situated between a substrate holder (5) and a target (4) of a plasma sputtering chamber (20) to control the lateral extent of the plasma. The auxiliary magnetic structure (11), possessing a lower field strength in the plasma region than a principal magnet (14) or magnets, is situated immediately outside of and around a circumference of the chamber's anode shield (10). The principal magnets (14) maintain the plasma in a ring adjacent to the sputtering target. The auxiliary magnet structure (11) causes the plasma ring to expand toward the edge of the target (4) or contract away from the edge depending on the magnetic strength and polarity of the structure and its position relative to the target (4). IMAGE