An Integrated Optics Chip with improved performance when exposedto rapidly changing temperature is disclosed. The optic chip orintegrated optic chip or MIOC has a top surface, a +Z face and-Z face. The chip is formed from a crystal having a high electro-opticcoefficient such as Lithium Niobate. For the purpose oforienting the components to the optic chip to be described, the+Z crystal axis extends outward from the +Z face. An inputwaveguide formed in the top surface of the chip and orthogonal tothe +Z axis receives an optical signal from an input port, passesthe signal via a waveguide network, to an output waveguidecoupling the waveguide network to an output port. Metalization isapplied to the top face of the optic chip to form at least afirst and a second rail. The first and second rails arepositioned to very closely straddle a portion of the inputwaveguide. A conductive bridge connects the first and secondrails to prevent a charge differential from developing betweenthe first and second rails.
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