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A method for mounting a printed circuit board in an EMC screen and an EMC screen

机译:在EMC屏幕中安装印刷电路板的方法及EMC屏幕

摘要

A printed circuit board (14A) is mounted in an EMC screen (13) with impact extruded pegs which are battered into holes (14B) in the printed circuit board, so that the printed circuit board is pressed against partitions (20) and supporting projections (16). Further the walls (17A) of the screen, particularly shaped to be bendable, are bent over the printed circuit board. The mounting will be robust due to the pegs (15A) and partitions (20) and the forces between the printed circuit board and the bent walls (17B). The grounding is formed between the supporting projections (16), the partitions (20) and the metallisations on the printed circuit board (14A). The pegs (15A) are electrically isolated from the printed circuit board in order to prevent corrosion. Both the bending of the edges (17A) and the battering of the pegs (15A) can be automated.
机译:将印刷电路板(14A)安装在带有冲击挤压钉的EMC屏幕(13)中,该钉被撞到印刷电路板上的孔(14B)中,以便将印刷电路板压在隔板(20)和支撑突起上(16)。此外,屏幕的壁(17A),特别是被成形为可弯曲的,在印刷电路板上弯曲。由于栓钉(15A)和隔板(20)以及印刷电路板和弯曲壁(17B)之间的作用力,因此安装牢固。在支撑突起(16),隔板(20)和印刷电路板(14A)上的金属化层之间形成接地。销钉(15A)与印刷电路板电气隔离,以防止腐蚀。边缘(17A)的弯曲和钉子(15A)的击打都可以自动化。

著录项

  • 公开/公告号EP0991308A2

    专利类型

  • 公开/公告日2000-04-05

    原文格式PDF

  • 申请/专利权人 NOKIA MOBILE PHONES LTD.;

    申请/专利号EP19990660154

  • 发明设计人 KONTKANEN MIKAEL;LONKA PEKKA;

    申请日1999-09-28

  • 分类号H05K7/14;

  • 国家 EP

  • 入库时间 2022-08-22 01:47:44

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