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Dosimetry cup charge collection in plasma immersion ion implantation

机译:等离子体浸没离子注入中的剂量杯电荷收集

摘要

Method and apparatus for causing ions to impact a workpiece implantation surface (14a). A process chamber (12) defines a chamber interior (42) into which one or more workpieces (14) can be inserted for ion treatment. An energy source (40) sets up an ion plasma within the process chamber (12). A support (30) positions one or more workpieces (14) within an interior region (42) of the process chamber (12) so that an implantation surface (14a) of the one or more workpieces (14) is positioned within the ion plasma. A pulse generator (50) in electrical communication with the workpiece support (30) applies electrical pulses for attracting ions to the support (30). One or more dosimetry cups (60) including an electrically biased ion collecting surface (69) are disposed around the workpiece support (30) to measure implantation current. An implantation controller (185) monitors signals from the one or more dosimetry cups (60) to control ion implantation of the workpiece (14).
机译:使离子撞击工件注入表面(14a)的方法和设备。处理腔室(12)限定腔室内部(42),一个或多个工件(14)可插入其中以进行离子处理。能量源(40)在处理室(12)内建立离子等离子体。支撑件(30)将一个或多个工件(14)定位在处理室(12)的内部区域(42)内,使得一个或多个工件(14)的注入表面(14a)位于离子等离子体内。与工件支架(30)电连通的脉冲发生器(50)施加电脉冲以将离子吸引到支架(30)。包括电偏压离子收集表面(69)的一个或多个剂量杯(60)围绕工件支架(30)设置以测量注入电流。注入控制器(185)监视来自一个或多个剂量杯(60)的信号,以控制工件(14)的离子注入。

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