首页> 外国专利> IMPROVED GAPFILL OF SEMICONDUCTOR STRUCTURE USING DOPED SILICATE GLASSES WITH MULTI-STEP DEPOSITION/ANNEAL PROCESS

IMPROVED GAPFILL OF SEMICONDUCTOR STRUCTURE USING DOPED SILICATE GLASSES WITH MULTI-STEP DEPOSITION/ANNEAL PROCESS

机译:掺有多步沉积/退火工艺的掺硅玻璃改善了半导体结构的间隙

摘要

The realization that improved notch is filled up in narrow space is by forming doped silicate glasses (231-235) and multistep deposit/annealing process. Doped silicate glasses (231-235) are partly seated in sufficiently high to cause to flow back. Then the silicate glass of part filling doping is annealed causes further to flow back and fill narrow space, reduces the aspect ratio in space. Part deposits and annealing is repeated as many times until the silicate glass of doping reaches required thickness.
机译:通过形成掺杂的硅酸盐玻璃(231-235)和多步沉积/退火工艺,可以在狭窄的空间中填充改进的缺口。掺杂的硅酸盐玻璃(231-235)部分固定在足够高的位置以引起回流。然后对部分填充掺杂的硅酸盐玻璃进行退火,使之进一步回流并填充狭窄的空间,降低空间的纵横比。零件沉积和退火重复多次,直到掺杂的硅酸盐玻璃达到所需的厚度。

著录项

  • 公开/公告号EP1025583A1

    专利类型

  • 公开/公告日2000-08-09

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号EP19980954322

  • 发明设计人 ILG MATTHIAS;KIRCHHOFF MARKUS;

    申请日1998-09-30

  • 分类号H01L21/768;H01L21/3105;

  • 国家 EP

  • 入库时间 2022-08-22 01:47:06

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