WAFER HAVING COVER, SEMICONDUCTOR DEVICE PRODUCTION EQUIPMENT, WAFER TRANSFERRING METHOD USED THEREIN

摘要

PURPOSE: a strict atmospheric of the lid that there is chip a back side to be formed is pressed in wafer-process and provides without being readily formed chip. CONSTITUTION: the chip includes: that the chip for the predetermined portions formation for covering (14) indicates the chip of specific direction, and wherein the chip is for manufacturing semiconductor device.