首页> 外国专利> MOLD WIN METHOD FOR PLATING ORIGINAL COPPER PLATE MOLD FOR CONTINUOUS CASTING

MOLD WIN METHOD FOR PLATING ORIGINAL COPPER PLATE MOLD FOR CONTINUOUS CASTING

机译:连铸原始铜模具的模铸法。

摘要

PURPOSE: A Mold Win method for plating copper plate mold is provided, which has good resistance to heat and abrasion and high hardness for continuous casting operation. CONSTITUTION: The method is provided to plate the copper plate with nickel and nickel -boron alloy in layers of one over the other. The process of forming the layer of nickel-boron alloy follows the steps of electrolytic cleaning and water cleaning of the nickel surface for pretreatment and placing the mold in an electrolyte including sulfuric acid, boric acid nickel sulfate to make the nickel electrode for an anode and form nickel plating nucleus on the nickel layer surface to plate a layer of nickel-boron alloy on it.
机译:目的:提供一种用于镀铜板模具的Mold Win方法,该方法具有良好的耐热性和耐磨性,并且在连续铸造操作中具有较高的硬度。构成:提供了用镍和镍-硼合金将铜板镀覆在另一层上的方法。形成镍-硼合金层的过程遵循以下步骤:对镍表面进行电解清洁和水清洁以进行预处理,然后将模具放置在包含硫酸,硼酸硫酸镍的电解质中,以制成阳极用镍电极和在镍层表面形成镀镍核,以在其上镀一层镍-硼合金。

著录项

  • 公开/公告号KR20000014802A

    专利类型

  • 公开/公告日2000-03-15

    原文格式PDF

  • 申请/专利权人 J TECH CO. LTD;

    申请/专利号KR19980034386

  • 发明设计人 LEE JEONG SOON;

    申请日1998-08-25

  • 分类号C23C28/00;

  • 国家 KR

  • 入库时间 2022-08-22 01:46:04

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