METAL FOIL WITH BUMP, A CIRCUIT BOARD WITH THE METAL FOIL, AND A SEMICONDUCTOR DEVICE WITH THE CIRCUIT BOARD

摘要

PURPOSE: A metal foil with bumps, a circuit board with the metal foil, and a semiconductor device with the circuit board are provided for bumps with an implementation structure enabling an outer connection node to be connected easily to a connection electrode. CONSTITUTION: A metal foil sheet includes bumps(22). The bumps(22) are coupled to a connection electrode(12) formed on one plane of a plane-implemented device such as a semiconductor chip(10) or a chip size package. The bumps(22) are implemented on the same plane arrangement as the connection electrode(12). The bumps(22) are exposed on one plane of the metal foil sheet(20). Further, outer connection nodes corresponding to the bumps are coupled a land. The land is formed on the other side of the metal foil sheet(20).