首页> 外国专利> METHOD FOR PREVENTING OVER ETCH OF BASE IN FABRICATION PROCESS OF TRANSFERRED-SUBSTRATE HETEROJUNCTION BIPOLAR TRANSISTOR

METHOD FOR PREVENTING OVER ETCH OF BASE IN FABRICATION PROCESS OF TRANSFERRED-SUBSTRATE HETEROJUNCTION BIPOLAR TRANSISTOR

机译:转移基质异质结双极性晶体管制造过程中防止基极过剩的方法

摘要

Purpose: a kind of method, for one transfer substrate heterojunction bipolar transistor a manufacturing process in a base corrosive agent on prevent be the etching process on the corrosive agent of bottom in collector layer during prevent. Construction: a Prevention method of a bottom includes the following steps:: forming a bar ditch in a selected region of a base object layer (20), is used to form the base region before forming a collector region; A photoresist mode is formed on base object layer around ditch; The metal layer being deposited in photoresist mode includes ditch; Take off photoresist jargon and covering metal layer, forms the index that can be felt in the depth by the etching in ditch exposure and the collector object layer (30) for being used to form collector region; Collector object layer is etched to form collector region, such base object layer is all without excessive erosion when feeling index.
机译:目的:一种方法,对于一个转移衬底异质结双极晶体管来说,在基础腐蚀剂上的制造过程是防止在腐蚀过程中对集电极层底部的腐蚀剂的蚀刻过程。构造:底部的预防方法包括以下步骤:在基础物体层(20)的选定区域中形成条沟,用于在形成集电极区域之前形成基础区域;在沟附近的基础物体层上形成光致抗蚀剂模式。以光刻胶模式沉积的金属层包括沟;去除光致抗蚀剂行话并覆盖金属层,形成在沟渠曝光中的蚀刻和用于形成集电极区域的集电极对象层(30)可在深度上感觉到的指标;蚀刻集电极层以形成集电极区,这样的基础层在感觉指标时都没有过度腐蚀。

著录项

  • 公开/公告号KR20000054983A

    专利类型

  • 公开/公告日2000-09-05

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号KR19990003380

  • 发明设计人 IN BYUNG UK;

    申请日1999-02-02

  • 分类号H01L21/8226;

  • 国家 KR

  • 入库时间 2022-08-22 01:45:19

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号