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METHOD FOR ALIGNING SUBSTRATES USING MACHINE VISION SYSTEM

机译:用机器视觉系统对基质进行标记的方法

摘要

The substrate position alignment method according to the present invention is a method of aligning a lower plate at a predetermined position under the upper plate by a machine vision system. The method includes a forming step, a displaying step, an imaging step and an alignment step. In the forming step, the first and second holes are formed at predetermined positions of the upper plate. In the display step, first and second reference marks corresponding to the holes are displayed at predetermined positions on the lower plate. In the imaging step, the upper plate is imaged while the lower plate is moved step by step under the upper plate. In the alignment step, the center coordinates of each hole and each reference mark are obtained from the pixel coordinates of the region whose brightness is changed in the image obtained by imaging of the top plate, and the center coordinates of each reference mark are corresponding to the center coordinates of the corresponding holes. The bottom plate is aligned to be close.
机译:根据本发明的基板位置对准方法是通过机器视觉系统将下板对准在上板下方的预定位置处的方法。该方法包括形成步骤,显示步骤,成像步骤和对准步骤。在形成步骤中,第一孔和第二孔形成在上板的预定位置处。在显示步骤中,在下板上的预定位置处显示与孔相对应的第一和第二参考标记。在成像步骤中,对上板进行成像,同时将下板逐步移至上板下方。在对准步骤中,从通过顶板的成像获得的图像中亮度改变的区域的像素坐标获得每个孔和每个参考标记的中心坐标,并且每个参考标记的中心坐标对应于相应孔的中心坐标。底板对齐以使其接近。

著录项

  • 公开/公告号KR100247998B1

    专利类型

  • 公开/公告日2000-04-01

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO LTD.;

    申请/专利号KR19970049753

  • 发明设计人 마연수;

    申请日1997-09-29

  • 分类号G01B11/26;

  • 国家 KR

  • 入库时间 2022-08-22 01:44:58

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