首页> 外国专利> SINTERING METHOD OF SEALANT FOR EVACUATION PACKAGING OF FIELD EFFECT FIELD EMISSION DISPLAY DEVICE

SINTERING METHOD OF SEALANT FOR EVACUATION PACKAGING OF FIELD EFFECT FIELD EMISSION DISPLAY DEVICE

机译:场效应显示装置排空包装用密封剂的烧结方法

摘要

The present invention facilitates alignment by making the sealant applied to the upper substrate or the lower substrate smoothly before aligning the upper substrate and the lower substrate of the FED, and prevents the upper substrate and the lower substrate from shifting each other when the sealant is sintered. A sealant sintering method for vacuum packaging of an FED that enables sintering of the sealant by local heating. The sealant sintering method for vacuum packaging of the FED of the present invention uses a sealant on at least one edge of an upper substrate having an anode electrode and a phosphor and a lower substrate having a cathode electrode and an emitter to maintain the interior of the FED element in a vacuum state. In the FED vacuum packaging sealant sintering method of sintering and sintering after coating, after drying or pre-sintering the coated sealant, the protective film is applied to the phosphor or emitter portion provided on the substrate to which the sealant is applied, and then dried. Making a step; Grinding the sealant to remove unevenness of the sealant to smooth the surface of the sealant and adjust the height of the sealant; And sintering the sealant while aligning the upper substrate and the lower substrate after removing and cleaning the protective film. In addition, the protective film may be first applied, the protective film at the position where the sealant is to be applied may be removed, and then the sealant may be applied to dry and presinter.
机译:本发明通过使在FED的上基板和下基板对准之前平滑地施加到上基板或下基板上的密封剂来促进对准,并且在烧结密封剂时防止上基板和下基板彼此移位。 。用于FED的真空包装的密封剂烧结方法,其能够通过局部加热来烧结密封剂。本发明的FED的用于真空包装的密封剂烧结方法在具有阳极和荧光体的上基板的至少一个边缘以及具有阴极和发射极的下基板的至少一个边缘上使用密封剂以保持其内部。 FED元件处于真空状态。在FED真空包装密封剂的烧结方法中,在涂覆后进行烧结和烧结,在将涂覆的密封剂干燥或预烧结之后,将保护膜涂覆到设置在涂覆有密封剂的基板上的荧光体或发射体部分上,然后干燥。 。迈出一步;研磨密封胶以去除密封胶的不平整度,以使密封胶的表面光滑并调整密封胶的高度;并且在去除和清洁保护膜之后,在对准上基板和下基板的同时烧结密封剂。另外,可以首先施加保护膜,可以去除要施加密封剂的位置处的保护膜,然后可以施加密封剂以进行干燥和预烧结。

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