LTCC-M SUBSTRATE PACKAGE STRUCTURE FOR RADIO FREQUENCY

摘要

The present invention relates to a low-temperature fired substrate package structure for high frequency, and provides a high-temperature low-temperature fired substrate package structure that can prevent pin-to-short shorting by using an insulation paste and minimize line resistance of leads by using solder balls. There is a purpose. In the low temperature calcined substrate package structure for high frequency, the metallic low temperature calcined ceramic substrate has a metal base and a multilayer ceramic substrate. The first and second insulating paste layers each have one surface adhered to the metal base of the metal-phase low temperature fired ceramic substrate and the surface of the multilayer ceramic substrate. The conductor is formed under the first insulating paste layer. The first and second solder portions are formed on the lower portion of the conductor and the upper portion of the second insulating paste layer, respectively. The lid has a bar, a first horizontal portion, a first vertical portion, a second horizontal portion, a second vertical portion, and a third horizontal portion. The solder ball is formed between the first horizontal portion and the first vertical portion of the lead to electrically connect the first horizontal portion and the second horizontal portion. According to the present invention, the insulating paste is adhered to both the metal base and the ceramic substrate to improve the short pin problem and to minimize the line resistance of the lead by using solder balls between the first and second horizontal portions of the lead.