LTCC-M SUBSTRATE PACKAGE STRUCTURE FOR RADIO FREQUENCY

摘要

The subject innovation is that to be related to the low-temperature co-fired ceramic package structure, the high-frequency receiving, prevent short occurs pingan using the insulating paste and provides a high-frequency receiving the low-temperature co-fired ceramic package structure, which can minimize the line resistance of the lead by using a solder ball there is a purpose. Receiving in the high-frequency low-temperature co-fired ceramic package structure, the low-temperature co-fired ceramic substrate, the metal has a metal base and a multilayer ceramic substrate. First and second insulating paste layer have each one surface to be bonded to the surface of the metal base, and a multilayer ceramic substrate of the low-temperature co-fired ceramic substrate, a metal. The conductor is formed in a lower portion of the first insulating paste layer. First and second solder portion is formed on the upper portion of the lower conductor and the second insulating paste layer. Lead has the bar, the first horizontal portion, a first vertical section, a second horizontal section, a second vertical portion, and a third horizontal section. Solder balls are formed between the first horizontal portion of the first vertical portion of the lead is electrically connected to the first horizontal portion and a second horizontal portion. According to the present invention, the adhesion to the insulating paste to the base metal and the ceramic substrate on both sides pingan improve short problem and minimize the line resistance of the lead using a solder ball to the first and the second horizontal portion of the read phase.