首页> 外国专利> Process for selective, area-wise coating of a transparent carrier plate with a metallic active layer using an etching process, as well as a correspondingly producible layer sequence and counter-embossing film that can be used for this

Process for selective, area-wise coating of a transparent carrier plate with a metallic active layer using an etching process, as well as a correspondingly producible layer sequence and counter-embossing film that can be used for this

机译:利用蚀刻工艺选择性地,局部地涂覆金属活性层的透明载体板的方法,以及相应的可生产的层序列和可用于此的反压花膜

摘要

The invention relates to a method for the selective, area-wise coating of a transparent carrier plate with a metallic active layer using an etching process in which the metallic active layer and in areas to be coated with the metallic active layer a cover layer are applied, whereupon the metallic active layer in the areas not covered by the cover layer is etched away, the metal active layer being embossed over the entire surface of the carrier plate via a counter-embossing film at least in an area which comprises the areas to be coated with the metal active layer, the cover layer in the form of a first color layer directly on the metal Active layer is applied on the side of the metallic active layer facing away from the carrier plate, and essentially only the metallic active layer is etched away in the areas not covered by the cover layer; as well as a layer sequence that can be produced afterwards and a counter-stamping foil that can be used for this.
机译:本发明涉及一种利用蚀刻工艺选择性地,选择性地在具有金属活性层的透明载体板上进行区域涂覆的方法,在该方法中,施加金属活性层并且在待涂覆金属活性层的区域中施加覆盖层。然后,蚀刻掉未被覆盖层覆盖的区域中的金属活性层,该金属活性层至少在包括待加工区域的区域中通过反压花膜在载体板的整个表面上压花。在涂覆有金属活性层的情况下,直接在金属活性层上的第一着色层形式的覆盖层被施加在金属活性层背离载体板的一侧,并且基本上仅蚀刻金属活性层远离覆盖层未覆盖的区域;以及随后可以产生的层序列以及可以用于此的反印箔。

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