Surface mounted pin socket based on capillary action for printed circuit board, has flat substrate with through contacted holes causing capillary effect on molten solder to pull it through substrate

摘要

The pin socket has a first flat substrate (20) with an array of through contacted holes (22) with first surfaces of uniform cross-section, a number of pins (30) extending through the holes, which also have a second uniform cross-section and channels dimensioned to cause a capillary effect on the molten solder at a channel opening on one side of the substrate, so that the solder is pulled through the channel to the opposite side of the substrate. A second substrate (10) carrying the solder (16) in a predefined array is applied to the first substrate. An Independent claim is also included for a method of mounting a number of surface mount pins on a circuit board.