Semiconductor chip mounting method, involves partially or completely soaking capillary meshing on substrate e.g. printed circuit board, using thin liquid adhesive, and fitting chips to capillary meshing

摘要

The method involves partially or completely soaking a capillary meshing on a substrate (1) using a thin liquid adhesive. Chips (2) are fitted to the capillary meshing filled with the adhesive by an application of a canula or dispenser. The adhesive is applied in a preset amount in an adhesive point. The capillary meshing is fastened at the substrate before filling the capillary meshing with the adhesive. The capillary meshing is pasted on the substrate and made of ceramic, glass, plastic or carbon fibers. An independent claim is also included for a capillary meshing for mounting a chip on a substrate.