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Single crystal, especially silicon single crystal, is grown under neck growth conditions of high pulling speed relative to the phase boundary axial temperature gradient

机译:单晶,特别是硅单晶,是在相对于相界轴向温度梯度高拉速的颈部生长条件下生长的

摘要

A single crystal growth process, in which the crystal neck portion is grown at a high ratio of pulling speed to phase boundary axial temperature gradient, is new. A single crystal growth process comprises growing the neck portion under conditions in which the quotient V/G(r) is greater than a constant Ckrit with a value of 1.3*10-3 cm2/K.min., where V = pulling speed, G(r) = axial temperature gradient at the solid/liquid phase boundary and r = radial distance from the center of the thin neck crystal.
机译:单晶生长工艺是新的,其中以高拉速与相界轴向温度梯度之比生长晶颈部分。单晶生长工艺包括在商V / G(r)大于常数Ckrit且值为1.3 1 * 10 -3 cm 2 /K.min的条件下生长颈部。其中V =提拉速度,G(r)=固/液相边界处的轴向温度梯度,r =距薄颈晶体中心的径向距离。

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