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Non-destructive testing device especially for quality control testing of soldered joints on electronic components

机译:无损检测设备,特别用于电子元件上的焊接接头的质量控制测试

摘要

The arrangement includes a test device (52) detecting a radiation beam extending from the object (42) being tested along a radiation path (O) in order to generate at least one image of the object (52) useable for optical testing. A manually operated optical arrangement (30) is used for deflecting at least part of the radiation from the tested object into the beam-path of the test device (52). The optical arrangement is specifically a flat mirror (30) for deflecting the light reflected from the object (42) into the radiation path (O) of the test device (52), the flat mirror (30) being mounted on a holder (16) and swivelled about an axis (A).
机译:该装置包括测试装置(52),该测试装置(52)检测沿着辐射路径(O)从被测试的物体(42)延伸的辐射束,以便产生可用于光学测试的物体(52)的至少一个图像。手动操作的光学装置(30)用于将来自被测物体的辐射的至少一部分偏转到测试装置(52)的光路中。光学装置具体地是用于将从物体(42)反射的光偏转到测试装置(52)的辐射路径(O)中的平面镜(30),该平面镜(30)安装在支架(16)上。 )并绕轴(A)旋转。

著录项

  • 公开/公告号DE19853052A1

    专利类型

  • 公开/公告日2000-05-25

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号DE1998153052

  • 发明设计人 WEISE JUERGEN;

    申请日1998-11-17

  • 分类号G01N21/88;G01N11/08;G01N21/01;H05K13/08;

  • 国家 DE

  • 入库时间 2022-08-22 01:42:29

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