Fire-resistant epoxy resin mixture for prepregs and composites, e.g. printed circuit boards, contains epoxy resin and an amino-aryl-phosphonate ester of an aliphatic glycol or tetra-hydroxy compound

摘要

An epoxy resin mixture for the production of prepregs and composites contains a cyclic aminoaryl-phosphonate ester of a 2-5C alkanediol or a spirocyclic bis-aminoaryl-phosphonate ester of pentaerythritol. An epoxy resin mixture for the production of prepregs and composite materials contains: (a) polyepoxide compound(s) with at least 2 epoxide groups, (b) a phosphorus-containing aromatic amine of formula (1) or (2); and (c) optionally (c) other conventional additives. in which: R = 2-5C alkylene; R' = H; R = 1-3C alkyl or alkoxy; m, n = 0-4; (m+n) = 4 Independent claims are also included for: (a) prepregs and composite materials based on inorganic or organic reinforcing materials, in the form of fibres, non-woven or woven fabric or sheet materials, made from such resin mixtures; (b) printed circuit boards made from prepregs produced from woven glass fibre mat and epoxy resin mixtures as above.