Epoxy resin mixture for production of composites, e.g. prepregs and laminates for printed circuit boards, contains special phosphorus-modified epoxy resin, dicyandiamide or aromatic amine and hardening accelerator

摘要

An epoxy resin mixture for composite production containing (a) phosphorus-modified epoxy resin, (b) dicyandiamide and/or aromatic amine derivative and (c) a hardening accelerator, in which component (a) is obtained by reacting polyepoxide compounds with phosphinic, phosphonic and/or pyrophosphonic acids. An epoxy resin mixture for the production of composites contains (a) a phosphorus-modified epoxy resin with an epoxide value of 0.02-1 mol/100 g, obtained by reacting (A) polyepoxide compounds with at least 2 epoxide groups with (B) phosphinic, phosphonic or pyrophosphonic acids, (b) dicyandiamide and/or an aromatic amine of formula (I) or (II) as hardener [Image] [Image] X : H; Y : 1-3C alkyl; m, n : 0-4; (m+n) : 4; R : OH or NR1R2; R1, R2H or 1-3C alkyl, or one of these groups is H or 1-3C alkyl and the other is NR3R4; R3, R4H or 1-3C alkyl and (c) a hardening accelerator. Independent claims are also included for the following: (i) prepregs or composites based on inorganic or organic reinforcing materials (as fibres, non-wovens, woven fabric or sheet materials) and made with the above epoxy resin mixture; and (ii) printed circuit board material produced from woven glass fibre fabric and the epoxy resin mixture.