Bonding wire feed device for semiconductor device manufacture, uses inner and outer sensors having adjoining, partial intersecting or spaced coverage areas and status monitor for controlling reel-off device and bonding process

摘要

An inner sensor and an outer sensor having adjoining, partially intersecting or spaced coverage areas, are provided in the deflection region of bonding wire between a motorized reel-off device and a wire bonding tool. A switching logic with a monitor assess the status of sensors for controlling the reel-off device and wire bonding process. Independent claims are also included for the following: (1) a method for controlling supply of bonding wire; (2) a method for controlling process of wire bonding.