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A process for the preparation of a piezoelectric / electrostrictive thick film using a impf - or seed layer
A process for the preparation of a piezoelectric / electrostrictive thick film using a impf - or seed layer
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机译:一种使用缺陷层或种子层制备压电/电致伸缩厚膜的方法
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摘要
A process for the production of a piezoelectric / electrostrictive thick film using a seed layer. On a substrate, the seed layer, which is made of a ceramic sol - solution or a ceramic paste is formed, both of which identical or similar to in their composition with the piezoelectric / electrostrictive film are. The ceramic paste is of a mixture of a ceramic oxide powder, with a particle size of 5 mu m or less, prepared from piezoelectric / electrostrictive elements on the pb - and / or ti - base by a not explosive oxidation / reduction - combustion reaction in the case of 100 - 500 deg c, as well as a ceramic sol - solution in water or an organic solvent, identical or similar to in the composition produced with the ceramic oxide powder. The seed layer is then subjected to an aftertreatment. A piezoelectric / electrostrictive film is formed directly on the seed layer. As an alternative, the piezoelectric / electrostrictive film is formed separately and be sintered and then be applied to the seed layer. At low temperature is then carried out a thermal treatment, in order to make the connection between the film and the substrate to cure. It is thus the piezoelectric / electrostrictive thick film made possible an excellent adhesion to the substrate in the case of the thermal treatment with low temperature to have.
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