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Production of a Ball Grid Array semiconductor component used in the manufacture of a Quad Flat Package comprises using a Tape Automated Bonding (TAB) strip
Production of a Ball Grid Array semiconductor component used in the manufacture of a Quad Flat Package comprises using a Tape Automated Bonding (TAB) strip
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机译:用于制造四方扁平封装的球栅阵列半导体组件的生产包括使用胶带自动粘结(TAB)条
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摘要
A Ball Grid Array semiconductor component is produced using a Tape Automated Bonding (TAB) strip. Production of a Ball Grid Array (BGA) semiconductor component comprises: (a) forming openings around each chip fixing region in a Tape Automated Bonding (TAB) strip (1); (b) fixing a semiconductor chip (3) to each fixing region of the TAB; (c) joining the chips at their electrode connecting surfaces (3a) to the TAB strip by bonding; (d) carrying out a plastic molding process with a resin on the bonded connection between the chip and the electrode connecting surface; (e) providing solder balls (8) on the reverse aide of the TAB strip in sections corresponding to the chip fixing sections; and (f) cutting the connecting sites to produce distinct semiconductor elements.
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