Semiconductor device has an electrode or wiring layer of a thick aluminum layer below a nickel layer to prevent an aluminum-nickel intermetallic compound from reaching the underlying substrate

摘要

A semiconductor device has an aluminum-based metal layer which is much thicker than an overlying nickel-based metal layer. A semiconductor device comprises a semiconductor substrate bearing an aluminum-based metal layer which is at least 5 times thicker than an overlying nickel-based metal layer. A solder is applied onto the nickel-based layer.