Semiconductor sensor, e.g. a capacitive-type acceleration sensor, is designed to avoid mobile and fixed section adhesion caused by electrostatic force, liquid surface tension and/or excessive external force

摘要

Semiconductor sensor comprises sensor and manipulation sections designed to avoid mobile and fixed section adhesion caused by electrostatic force, liquid surface tension and/or excessive external force. A semiconductor sensor comprises: (i) a sensor section (101) having a mobile section (2) with a weight section (6) supported on a semiconductor substrate for applied force-dependent movement, a mobile electrode (9a, 9b) integral with the weight section and having a detection surface, and a fixed electrode (3b, 4b) supported on the substrate and having a detection surface opposite the detection surface of the mobile electrode; and (ii) a manipulation section (102) formed on the substrate, isolated from the sensor section (101) by an isolation section (103) and externally contactable when the sensor is manipulated. Independent claims are also included for the following: (I) a semiconductor sensor comprising the sensor section (101) described above, in which the gap between opposing non-detection surfaces of the mobile and fixed electrodes is smaller than the gap between the opposing detection surfaces; (II) a semiconductor sensor comprising the sensor section (101) above, in which an elastic support section (7a, 7b) for the mobile section (2) can move in a certain direction and has a non-detection surface in a direction other than this certain direction and the gap between this non-detection surface and an opposite surface is smaller than any other gap between other sections; (III) a semiconductor sensor comprising the sensor section (101) above, in which an abutment is supported on the substrate and is spaced from the mobile section by a gap smaller than the detection gap; and (IV) a process for producing the above semiconductor sensor.